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Bergquist Sil Pad TSP 2000 – 0.38mm
£0.00 SKU: BERGQ_SILPAD_2000ST_0.38MM- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Highly Conformable, low hardness
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Highly Conformable
- Non-Flammable, Isolation
- High Heat Conducting Gel materials.
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- Highly Conformable
- Non-Flammable, Isolation
- High Heat Conducting Gel materials
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- Highly Conformable
- Non-Flammable
- Isolation
- High Heat Conducting Gel materials.
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- Highly Conformable
- Non-Flammable
- Isolation
- High Heat Conducting Gel materials
