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- Double-sided, thermal adhesive tape consisting of a KAPTON polyimide film and silicone rubber
- Delivers excellent electrical isolation in combination with good thermal connection
- Pressure sensitive application improving to maximum bond strength after 24 hours
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Universal Science Bondline 700 Single Liner – 0.15mm
£0.00 SKU: UNISCI_BONDLINE_700_SL_0.15MM- Electrically isolating, acrylic thermal tape
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Allows sufficient heat exchange between component and cooling mechanism
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Universal Science Bondline 700 Twin Liner – 0.15mm
£0.00 SKU: UNISCI_BONDLINE_700_TL_0.15MM- Electrically isolating, acrylic thermal tape
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Allows sufficient heat exchange between component and cooling mechanism
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Universal Science Bondline 700 Twin Liner – 0.25mm
£0.00 SKU: UNISCI_BONDLINE_700_TL_0.25MM- Electrically isolating, acrylic thermal tape
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Allows sufficient heat exchange between component and cooling mechanism
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Universal Science Bondline 700 Twin Liner – 0.5mm
£0.00 SKU: UNISCI_BONDLINE_700_TL_0.5MM- Electrically isolating, acrylic thermal tape
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Allows sufficient heat exchange between component and cooling mechanism
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Universal Science Bondline 700 Single Liner (3300cm x 1.6cm Roll) – 0.25mm Thick
£57.95 SKU: UNICSCI_BONDLINE_700_SL_w16MMw_t0.25MM_ROLL- Electrically isolating, acrylic thermal tape
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Allows sufficient heat exchange between component and cooling mechanism
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Add to basket
Universal Science Bondline 700 Single Liner (3300cm x 2cm Roll) – 0.25mm Thick
£57.95 SKU: UNICSCI_BONDLINE_700_SL_0.25MM_ROLL- Electrically isolating, acrylic thermal tape
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Allows sufficient heat exchange between component and cooling mechanism
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- High mechanical strength
- Improved surface wet-out for rough surface/LSE substrates
- Excellent shock performance
