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Showing 1–15 of 64 results
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
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Universal Science UniPhase 4000 COB – 0.125mm
£0.00 SKU: UNISCI_UNIPHASE4000COB_0.125MM- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
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Universal Science Bondline 700 Twin Liner – 0.25mm
£0.00 SKU: UNISCI_BONDLINE_700_TL_0.25MM- Electrically isolating, acrylic thermal tape
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Allows sufficient heat exchange between component and cooling mechanism
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- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
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Universal Science T-Pad 1500 – A1 – 0.23mm
£0.00 SKU: UNISCI_TPAD1500_A1_0.23MM- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
- A1 – Adhesive layer on one side
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- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
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- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
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- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
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- Low water absorption
- Good dimensional stability
- Excellent Electrical Properties
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- Ceramic filled gap filling pad
- Thermal conductivity = 6.0W/mK
- Compliant surfaces on both sides function to reduce interfacial thermal resistance
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- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
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- Micro-air voids between connecting surfaces are minimised
- Delivers an electrically isolating structural bond
- Cost effective thermal adhesive tape
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Universal Science T-Pad 6500 – A1 – 0.2mm
£0.00 SKU: UNISCI_TPAD6500_A1_0.2MM- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
- A1 – Adhesive layer on one side
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- Compliant and electrically insulating
- Thermal conductivity = 1.8 W/mK
- Delivers excellent vibration dampening properties
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- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
