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- Thermal impedance: 1.13ºC-in2/W @ 50 psi
- Original Sil-Pad material
- Excellent mechanical and physical characteristics
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Bergquist Sil Pad TSP 1800ST – 0.203mm
£0.00 SKU: BERGQ_SILPAD1800ST_0.203MM- Thermal impedance: 0.23°C-in2/W (@50 psi)
- Naturally tacky on both sides
- Pad is repositionable
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Bergquist Sil Pad TSP 1600S – 0.229mm
£0.00 SKU: BERGQ_SILPAD_1600ST_0.229MM- Thermal impedance: 0.61ºC-in2/W (@50 psi)
- Electrically isolating
- Low mounting pressures
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Thermal impedance: 0.61�C-in2/W (@50 psi)
Electrically isolating
Low mounting pressures -
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- Thermal impedance: 0.33ºC-in2/W @ 50 psi
- Optimal heat transfer
- High Thermal Conductivity: 3.5 W/m-K
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
