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- Thermal impedance: 1.13ºC-in2/W @ 50 psi
- Original Sil-Pad material
- Excellent mechanical and physical characteristics
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Thermal impedance: 0.61 C-in2/W (@50 psi)
- Electrically isolating
- Low mounting pressures
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Bergquist Sil Pad TSP 1500ST – 0.38mm
£0.00 SKU: BERGQ_SILPAD1800ST_0.38MM- Thermal impedance: 0.23°C-in2/W (@50 psi)
- Naturally tacky on both sides
- Pad is repositionable
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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Bergquist Sil Pad TSP 2000 – 0.38mm
£0.00 SKU: BERGQ_SILPAD_2000ST_0.38MM- Thermal impedance: 0.61ºC-in2/W (@50 psi)
- Electrically isolating
- Low mounting pressures
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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Select options
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
