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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Provides heat exchange between component and cooling mechanism
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Provides heat exchange between component and cooling mechanism
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Provides heat exchange between component and cooling mechanism
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- Fast Installation
- Flexible
- Self Extinguishing
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- Fast Installation
- Flexible
- Self Extinguishing
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- Fast Installation
- Flexible
- Self Extinguishing
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- Fast Installation
- Flexible
- Self Extinguishing
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- Density = 90 – 130 kg/m3
- Hardness Shore OO = 14
- Water Absorption = < 15%
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- Dry compound coated onto a Kapton™ MT substrate
- Offers high dielectric strength and cut-through resistance alongside efficient heat transfer
- Delivers a highly reliable and consistent thermal interface for demanding applications
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- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Easy to rework
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- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Easy to rework
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- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Easy to rework
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- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Easy to rework
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications
- Thermal Conductivity of 5.5 W/mk
