UniGap 7000ES™ – 4.5mm | Universal Science™

Silicone Thermal Interface Pad

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  •  Extremely soft and compliant silicone gap filler
  •  Thermal conductivity = 7 W/mK
  •  Provides good electrical isolation
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Stock sheet size: 45.72cm x 45.72cm

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Description

UniGap 7000ES is an extremely soft and ceramic-filled silicone gap filler, designed to thermally couple a wide range of heat dissipating components.

UniGap 7000ES is robust and compressible over an extensive range of stack up tolerances where minimal pressure forces are exerted onto component parts. The material can be supplied with a fabric or film liner on one side for additional guaranteed electrical isolation and to provide greater cut through resistance.

Benefits

  • Soft and conformable enabling usage with components of multiple heights and sizes with a single pad
  • Maintains optimal performance over a wide range of temperatures
  • High deflection properties

Features

  • Extremely soft and compliant silicone gap filler
  • Thermal conductivity = 7 W/mK
  • Exerts very low pressures to devices and components when in operation
  • Provides good electrical isolation

Recommended Uses

  • Typically used in any gap filler application where multiple component height and size differences exist
  • Memory cards and VGA modules
  • Cooling digital signal processing (DSP) units
  • Cooling power devices in AC-DC and DC-DC PSUs
Typical Physical Properties
Property (unit) Test Method UniGap 7000ES
Colour Visual Grey
Thickness (mm) In House 1.0 – 5.0
Thermal Conductivity
(W/mK)
ASTM D5470 7
Hardness (Shore 00) ASTM D2240 10
Thermal Impedance (°C
in.²/W) @ 50%
ASTM D5470 1.75
Operating Temp. (°C) – -42 to +120
Flame Rating UL94 V-0
Electrical and Mechanical Information
Property (unit) Test Method UniGap 7000ES
Outgassing TML (weight %) ASTM E595 0.20
Dielectric Constant (1 MHz) ASTM D150 7.94
Volume Resistivity (Ω-cm) ASTM D257 1.1 x 10¹⁴





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