Description
Universal Science™ UniGap® 6000 is one of our highest performing ceramic filled thermal gap pads that has Compliant surfaces on both sides delivering 6.W/MK of thermal conductivity due to this high thermal conductivity it is extremely efficient in the maximisation of heat transfer to a heatsink from a component in addition to being electrically insulating via high dielectric strength.
UniGap® is formulated with ceramic particles enabling extremely consistent and repeatable thermal performance, despite having this high thermal conductivity UniGap® still displays inherent softness for the most delicate of uses, this in combination with stability over a wide range of operating temperatures makes UniGap® ideal For filling micro air voids between contact surfaces facilitating excellent thermal transfer performance for demanding applications where a robust and high performance thermal gap pad is needed. Cooling portable , military, medical and aerospace electronics. Additional cooling for FETs or other power devices.
This material can be supplied in thicknesses of 0.5mm – 5mm
Other Thicknesses:
Benefits
- High thermal conductivity for efficient maximisation of heat transfer to a heatsink or nearby metal work
- Despite high thermal conductivity inherent softness is still exhibited
- Fills micro air voids between contact surfaces for improved thermal performance
