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2 Sheets In Stock
Universal Science™ UniGap® 6000 is one of our highest performing ceramic filled thermal gap pads that has Compliant surfaces on both sides delivering 6.W/MK of thermal conductivity due to this high thermal conductivity it is extremely efficient in the maximisation of heat transfer to a heatsink from a component in addition to being electrically insulating via high dielectric strength.
UniGap® is formulated with ceramic particles enabling extremely consistent and repeatable thermal performance, despite having this high thermal conductivity UniGap® still displays inherent softness for the most delicate of uses, this in combination with stability over a wide range of operating temperatures makes UniGap® ideal For filling micro air voids between contact surfaces facilitating excellent thermal transfer performance for demanding applications where a robust and high performance thermal gap pad is needed. Cooling portable , military, medical and aerospace electronics. Additional cooling for FETs or other power devices.
This material can be supplied in thicknesses of 0.5mm – 5mm
|Thermal Conductivity (W/mK
|Hardness (Shore 00)
|Thermal Impedance (°Cinch²/W @ 138KPa)
|Operating Temp. (°C)
|-45 to +190
|Tensile Strength (PSI)
|Breakdown Voltage (Volts AC)
|Dielectric Constant (@1MHz)
|Outgassing CVCM (%)
|Thicknesses of 0.5mm to 5.0mm in incremental steps of 0.5mm
|Available as custom die-cut shapes and standard sheet sizes of 229mm x 229mm
|Can be supplied with fibreglass reinforcements for additional strength and puncture resistance
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