Description
Universal Science™ UniGap® 10000NS is a high performance, cost effective, non-silicone thermal gap pad solution for high thermal dissipation. This thermal interface material delivers an impressive 10W/Mk thermal conductivity, due to this high thermal conductivity it is extremely efficient in the maximisation of heat transfer to a heatsink from a component.
This thermal gap filler combines low thermal resistance values with excellent thermal wet-out properties for superb thermal performance. Compliant in nature and naturally tacky on both sides of the material and is ideal for filling micro air voids between contact surfaces facilitating excellent thermal transfer performance for demanding applications where a robust and high-performance non-silicone thermal gap filler is needed.
This material is supplied in thicknesses of 0.5mm – 5mm.
Other Thicknesses:
- UniGap 10000NS™ Gap Pad – 0.5mm
- UniGap 10000NS™ Gap Pad – 0.75mm
- UniGap 10000NS™ Gap Pad – 1mm
- UniGap 10000NS™ Gap Pad – 1.25mm
- UniGap 10000NS™ Gap Pad – 1.5mm
- UniGap 10000NS™ Gap Pad – 1.75mm
- UniGap 10000NS™ Gap Pad – 2mm
- UniGap 10000NS™ Gap Pad – 2.25mm
- UniGap 10000NS™ Gap Pad – 2.5mm
- UniGap 10000NS™ Gap Pad – 2.75mm
- UniGap 10000NS™ Gap Pad – 3mm
- UniGap 10000NS™ Gap Pad – 3.25mm ← You are here
- UniGap 10000NS™ Gap Pad – 3.5mm
- UniGap 10000NS™ Gap Pad – 3.75mm
- UniGap 10000NS™ Gap Pad – 4mm
- UniGap 10000NS™ Gap Pad – 4.25mm
- UniGap 10000NS™ Gap Pad – 4.5mm
- UniGap 10000NS™ Gap Pad – 4.75mm
- UniGap 10000NS™ Gap Pad – 5mm
Benefits
- Softness results in low pressures applied to devices
- High thermal conductivity and electrical isolation
- Cost effective gap filler solution for high thermal dissipation resulting in enhanced reliability
- Improved die cutting and part stability while handling
