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16 Sheets In Stock
Universal Science™ UniPhase® 2000 is a phase changing thermal interface material and is supplied as a dry compound coated onto an aluminium substrate, formulated to function as a superb alternative to messy and inconsistent thermal grease, it also delivers consistent and reliable thermal performance.
UniPhase® will flow at a phase change temperature of 60°C and conform to the differing surface textures between a heatsink and device, once the material exceeds the phase change temperature the compound becomes thixotropic and paste-like in consistency.
In combination with device mounting pressure and phase change flow, UniPhase® expels air voids at the interface helping to reduce thermal resistance. UniPhase® can be die-cut to suit a wide variety of electronic applications such as DC/DC power converters and is typically between any heat dissipating electrically isolated component and heatsink.
|Total Thickness – includes compound and substrate (mm)
|Max Operating Temp.(°C)
|Thermal Impedance @ 20psi (°C-cm²/W)
|Thermal Impedance @ 100psi (°C-cm²/W)
|Phase Change Temperature (°C)
|Volumetric Expansion upon phase-change (%)
|Supplied in custom die-cut preforms and pads on sheets or rolls
|Available in a variety of thicknesses to suit individual application requirements
|Indefinite shelf life, within original packaging in conditions below 40°C
Precision cut technical materials fast
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