TPli™ 260 – 1.5mm | LairdCustom pads and gaskets priced instantly and made to order within 24 hours!

TPli™ 260 – 1.5mm | Laird

Silicone based Thermal Gap Filler | A10098-32

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  • Electrically insulating
  • Thermal conductivity = 6.0W/mK
  • Low Dielectric Constant
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Stock sheet size: 40.64cm x 40.64cm

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SKU: 93862 Categories: , , Brand:

Description

Tpli™ 200 is a premium gap filler. A unique blend of boron nitride and silicone produce the highest performing interface pad. The materials exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. This material is electrically insulating, stable from -45°C to 200°C, and meets UL 94 HB rating.

A10098-32

 

Other Thicknesses:

Benefits

  • Low Dielectric Constant
  • High thermal performance

Features

  • Thermal conductivity = 6.0W/mK
  • Compliant surfaces on both sides function to reduce interfacial thermal resistance
  • Electrically insulating

Recommended Uses

  • Automotive ADAS, Automotive Electronics, Automotive Infotainment, Automotive Powertrain/ECUs, Drones/Satellites, Gaming Systems, Instrumentation, Notebooks/Tablets/Portable Devices, Routers, Smart Home Devices, Wireless infrastructure

Specifications

Typical Properties Typical Value Test Method
Construction & Composition Boron nitride filled silicone
sheet		 N/A
Color Varies by thickness Visual
Thickness Range 0.25mm (0.010”) – 5.08mm
(0.20”)		 N/A
Thickness Tolerance +/- 10% N/A
Thermal Conductivity (W/mK) 6.0 ASTM D5470
Density (g/cc) 1.4 Helium
Pycnometer
Hardness (Shore 00) 70 ASTM D2240
Outgassing TML (weight %) 0.46 ASTM E595
Outgassing CVCM (weight %) 0.15 ASTM E595
Temperature Range -45°C to 200°C N/A
Rth@ 40 mils, 10 psi, 500C 0.25°C–in2/W ASTM D5470
(modified)
Dielectric Constant @ 10GHz 3.2 * ASTM D150
UL Flammability Rating HB UL 94
Volume Resistivity 5×10^13 ohm-cm ASTM D257

TPli 200 Series Datasheet





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