Tpcm 910 – 0.25mm | Laird

Non-Silicone High Performance Phase Change TIM

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  • 0.03ºC-in2/watt thermal resistance
  • Naturally tacky at room temperature, no adhesive required
  • No heatsink preheating required
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Stock sheet size: 22.8cm x 22.8cm

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Description

Tpcm 910 is a high-performance, non-electrically conductive phase-change material. At 50°C, Tpcm™ 900 begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the component’s surfaces, thereby reducing thermal resistance. It is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. TPCM 900 shows no performance degradation after 1,000 hours @130°C, or after 500 cycles, from -25°C to 125°C. The material softens and does not fully change state, resulting in minimal migration(pump-out) at operating temperatures (see viscosity curve). Supplied in rolls with top tabbed liners for easy manual or large volume automatic application. Individually die-cut parts can also be supplied.

Manufacturers SKU: A10832-09

Benefits

  • Shows no performance degradation after 1,000 hours @130°C, or after 500 cycles, from -25°C to 125°C
  • Softens and does not fully change state, resulting in minimal migration(pump out) at operating temperatures (see viscosity curve)
  • Individually die cut parts can also be supplied

Features

  • 0.03ºC-in2/watt thermal resistance
  • Naturally tacky at room temperature, no adhesive required
  • No heatsink preheating required
  • Available in 3 thicknesses, 0.005”, 0.010”and 0.020” (0.125 mm, 0.25 mm and 0.50 mm)

Recommended Uses

  • High frequency microprocessors
  • Notebook and desktop PCs
  • Computer servers
  • DC/DC converts
  • Memory modules
  • Cache chips
  • IGBTs
Properties
PROPERTIES Tpcm™ 910 Test Method
Construction &
Composition
Non-reinforced
boron nitride filled film
Colour Yellow Visual
Thickness 0.010” (0.25 mm)
Thickness Tolerance ± 0.001” (± 0.025 mm)
Density 1.39 g/cc Helium Pycnometer
Temperature Range -25 to 125°C
Phase Change
Softening Temperature
50°C to 70°C
“Burn In“ Temperature 70°C for 5 minutes
Thermal Conductivity 2.23 W/mK ASTM D5470
(modified)
Thermal Impedance
@ 10 psi (69 KPa)
0.14 °C-in2
/W
(0.90 °C-cm2
/W)
ASTM D5470
(modified
Thermal Impedance @ 50 psi (345 KPa)) 0.083 °C-in2
/W
(0.53 °C-cm2
/W)
ASTM D5470
(modified
Volume Resistivity 2 x 1013 ohm-cm ASTM D257
Dielectric Constant
@1 MHz
3.1 ASTM D150





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