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August 5, 2019
Laird Tpcm™ 900 Series – 910 – 0.25mm
High Performance Phase Change TIM
£0.00
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- 0.03ºC-in2/watt thermal resistance
- Naturally tacky at room temperature, no adhesive required
- No heatsink preheating required
12 Sheets In Stock
Description
Tpcm™ 900 is a high-performance, non-electrically conductive phase-change material. At 50°C, Tpcm™ 900 begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the component’s surfaces, thereby reducing thermal resistance. It is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. TPCM 900 shows no performance degradation after 1,000 hours @130°C, or after 500 cycles, from -25°C to 125°C. The material softens and does not fully change state, resulting in minimal migration(pump-out) at operating temperatures (see viscosity curve). Supplied in rolls with top tabbed liners for easy manual or large volume automatic application. Individually die-cut parts can also be supplied.
Benefits
- Shows no performance degradation after 1,000 hours @130°C, or after 500 cycles, from -25°C to 125°C
- Softens and does not fully change state, resulting in minimal migration(pump out) at operating temperatures (see viscosity curve)
- Individually die cut parts can also be supplied
Features
- 0.03ºC-in2/watt thermal resistance
- Naturally tacky at room temperature, no adhesive required
- No heatsink preheating required
- Available in 3 thicknesses, 0.005”, 0.010”and 0.020” (0.125 mm, 0.25 mm and 0.50 mm)
Recommended Uses
- High frequency microprocessors
- Notebook and desktop PCs
- Computer servers
- DC/DC converts
- Memory modules
- Cache chips
- IGBTs
Properties
| PROPERTIES | Tpcm™ 910 | Test Method |
|---|---|---|
| Construction & Composition | Non-reinforced boron nitride filled film | |
| Colour | Yellow | Visual |
| Thickness | 0.010” (0.25 mm) | |
| Thickness Tolerance | ± 0.001” (± 0.025 mm) | |
| Density | 1.39 g/cc | Helium Pycnometer |
| Temperature Range | -25 to 125°C | |
| Phase Change Softening Temperature | 50°C to 70°C | |
| “Burn In“ Temperature | 70°C for 5 minutes | |
| Thermal Conductivity | 2.23 W/mK | ASTM D5470 (modified) |
| Thermal Impedance @ 10 psi (69 KPa) | 0.14 °C-in2 /W (0.90 °C-cm2 /W) | ASTM D5470 (modified |
| Thermal Impedance @ 50 psi (345 KPa)) | 0.083 °C-in2 /W (0.53 °C-cm2 /W) | ASTM D5470 (modified |
| Volume Resistivity | 2 x 1013 ohm-cm | ASTM D257 |
| Dielectric Constant @1 MHz | 3.1 | ASTM D150 |
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