Tmate™ 2910 – 0.25mm | Laird

Non-Silicone Phase Change Material | A16345-08

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  • Low thermal resistance at low pressures
  • Reusable: make and break thermal interface connection many times
  • Naturally tacky at room temperature, no adhesive required
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Description

The Tmate™ 2900 Series is a reusable phase change material (PCM) designed for ease of testing and rework ability. It has a composite construction of a special malleable metal alloy and a high-performance PCM.

At 50°C, the Tmate 2900 Series begins to soften and flow, filling the microscopic irregularities of the thermal solution, thus reducing thermal resistance.

It shows no thermal performance degradation after 1,000 hours @130°C, or after 500 cycles from -25°C to 125°C. The PCM softens and does not fully change state, resulting in minimal migration (pump-out) at operating temperatures (see viscosity curve). It is available in three thicknesses: 0.005” (0.125 mm), 0.010” (0.25 mm), and 0.020” (0.5 mm).

Manufacturers SKU: A16345-08

Benefits

  • No heat sink preheating required
  • Reusable: make and break thermal interface connection many times

Features

  • Low thermal resistance at low pressures
  • Naturally tacky at room temperature, no adhesive required
  • Reusable Phase Change Material

Recommended Uses

  • High frequency microprocessors, Notebook and desktop PCs, COmputer Servers, Thermal test stands
Specifications
Properties Tmate 2910c
Construction & Composition Foil reinforced boron nitride filled film
Colour Yellow Silver
Thickness 0.010” (0.25 mm)
Thickness tolerance ± 0.001” (±0.03 mm)
Density 1.64 g/cc
Shelf life 1 Year
Temperature range -25°C to 125°C
Phase change softening temperature 50°C to 70°C
“Burn-In” temperature 70°C for 5 min
Thermal impedance @20 psi 0.09°C-in2
/W
Thermal impedance @130 KPa 0.61°C-cm2
/W
Volume resistivity 5 x 1012 ohm-cm
Dielectric constant @ 1 MHz 4.2





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