Description
Parker Chomerics THERM-A-GAPâ„¢ PAD 80 is a silicone-based thermally conductive gap filler pad designed to improve heat transfer between electronic components and heat sinks or other thermal management surfaces. It features a soft (30 Shore 00) elastomer with a thermal conductivity of 8.3W/m-K, enabling effective dissipation of heat across air gaps and rough surfaces typical found in electronic assemblies.
THERM-A-GAP PAD 80 is RoHS compliant and rated UL 94 V-0 for flammability, making it suitable for a range of commercial, industrial, automotive, and telecom applications where controlled heat flow is needed to maintain component reliability.
G: Woven glass carrier – offset to one side. No pressure sesnsitive adhesive (PSA) option
MPN: 69-12-1015-PAD80G
Benefits
- Improves heat transfer across uneven surfaces and air gaps.
- Soft, compliant silicone conforms under low pressure.
- Supports reliable thermal management in electronic assemblies.




