THERM-A-GAP PAD30 – 2.03mm | Parker ChomericsCustom pads and gaskets priced instantly and made to order within 24 hours!

THERM-A-GAP PAD30 – 2.03mm | Parker Chomerics

Silicone Gap Filler

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  • Hardness Shore OO = 30
  • Thermal conductivity = 3.2 W/ mK
  • UL 94 V-0 Rated
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SKU: 93287 Categories: , , Brand:

Description

Parker Chomerics THERM-A-GAPâ„¢ PAD 30 is a silicone-based thermally conductive gap filler pad designed to improve heat transfer between electronic components and heat sinks or other thermal management surfaces. It features a soft (30 Shore 00) elastomer with a thermal conductivity of 3.2W/m-K, enabling effective dissipation of heat across air gaps and rough surfaces typical found in electronic assemblies.

THERM-A-GAP PAD 30 is RoHS compliant and rated UL 94 V-0 for flammability, making it suitable for a range of commercial, industrial, automotive, and telecom applications where controlled heat flow is needed to maintain component reliability.

MPN: 69-11-21259-PAD30

Benefits

  • Improves heat transfer across uneven surfaces and air gaps.
  • Soft, compliant silicone conforms under low pressure.
  • Supports reliable thermal management in electronic assemblies.

Features

  • Shore OO = 30
  • Thermal conductivity = 3.2 W/mK
  • UL 94 V-0 Rated

Recommended Uses

  • Telecommunications equipment
  • Consumer electronics
  • Automotive electronics (ECUs)
  • LEDs, lighting
  • Power conversion
  • Power semiconductors
  • Desktop computers, laptops, servers
  • Handheld devices
  • Memory modules
  • Vibration Dampening
Physical
Typical Properties PAD 30 Test Method
Color Blue Visual
Carrier Options:<br>- G = Woven Glass – no pressure sensitive adhesive (PSA)<br>- A = Aluminum Foil – with PSA<br>- PN = PEN Film<br>- KT = Thermally enhanced Polyimide<br>- No letter Suffix = None (unsupported) <br>PAD30G<br>PAD30A<br>PAD30PN<br>PAD30KT<br>PAD30 <br><br><br>-
Standard Thicknesses*, in. (mm) 0.020 – 0.200<br>(0.51 – 5.08) ASTM D374
Specific Gravity 2.9 ASTM D792
Hardness, Shore OO 30 ASTM D2240
Percent Deflection @ Various Pressures**<br>(0.120 in thick sample)<br>- @ 5 psi (34 kPa)<br>- @ 10 psi (69 kPa)<br>- @ 25 psi (172 kPa)<br>- @ 50 psi (345 kPa) % Deflected<br><br>17%<br>26%<br>38%<br>49% <br>ASTM C 165 MOD<br>(0.120 in with no Carrier,<br>0.50 in dia. probe,<br>0.025 in/min rate)
Thermal
Typical Properties PAD 30 Test Method
Operating Temperature Range, °F (°C) -67 to 392<br>(-55 to 200) Chomerics
Thermal Conductivity, W/m-K 3.2 ASTM D5470
Thermal Impedance, °C-in<sup>2</sup>/W (°C-cm<sup>2</sup>/W)<br>@ 10 psi, @ 0.04 in. (1mm) thick, “G” version 0.4<br>(2.6) ASTM D5470
Heat Capacity, J/g-K 1 ASTM E1269
Coefficient of Thermal Expansion, ppm/K 150 ASTM E831
Electrical
Typical Properties PAD 30 Test Method
Dielectric Strength, V<sub>AC</sub>/mil (kV<sub>AC</sub>/mm) 150 (5.9) ASTM D149
Volume Resistivity, ohm-cm 10<sup>13</sup> ASTM D257
Dielectric Constant @ 1,000 kHz and at 0.039 (1mm) thick 7.7 ASTM D150
Dissipation Factor @ 1,000 kHz and at 0.039 (1mm) thick 0.001 CHO-TM-TP13
Regulatory
Typical Properties PAD 30 Test Method
Flammability Rating<br>(See UL File E140244 for Details) V-0 UL 94
RoHS Compliant Yes Chomerics Certification
Outgassing, % TML (% CVCM) 0.13 (0.03) ASTM E595
Shelf Life, months from date of shipment (PAD 30A) 36 (18) Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90<br>(10 to 32) Chomerics

THERM-A-GAP PAD 30 Datasheet





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