TG-P10090 Graphene – 0.09mm | T-Global Technology™Custom pads and gaskets priced instantly and made to order within 24 hours!

TG-P10090 Graphene – 0.09mm | T-Global Technology™

Graphene Thermal Interface Material

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  • Ultra-High Thermal Conductivity
  • Copper Foil Backing
  • Ultra-Thin & Lightweight
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SKU: 93143 Categories: , ,

Description

The TG-P100 Series from T-Global Technology is an ultra-thin graphene-based thermal interface material (TIM) with a copper backing, designed for superior heat dissipation in high-performance electronic applications. With exceptional thermal conductivity (from 1500 – 1800 W/m·K in-plane) and a durable copper foil backing, this advanced material efficiently transfers and spreads heat, reducing thermal resistance and preventing overheating in compact and high-power devices.

Benefits

  • Ultra-High Thermal Conductivity
  • Copper Foil Backing
  • Ultra-Thin & Lightweight
  • Superior Heat Spreading & Dissipation
  • Flexible & Conformable
  • Long-Term Durability

Features

Ultra-Thin and Low Mass

  • With a total thickness of just 50 – 90 micrometers, the TG-P10090 is exceptionally thin and lightweight, making it ideal for applications where space and weight are critical considerations.

High Thermal Conductivity

  • The material exhibits outstanding thermal conductivity, ranging from 1500 to 1800 W/m·K in the XY plane, ensuring efficient heat transfer and dissipation.

Copper Foil Backing

  • The inclusion of a 35 – 75μm copper foil enhances heat spreading capabilities and provides structural stability, contributing to the material’s durability and performance.

No Dusting Issue

  • The TG-P100 Series is designed to prevent dust generation, ensuring a clean application environment and maintaining the integrity of sensitive electronic components.

Suitable for Unventilated Designs

  • Its efficient thermal management properties make it suitable for use in designs without active ventilation, maintaining optimal performance in passive cooling scenarios.

Recommended Uses

  • High-Performance Computing – CPUs, GPUs, gaming consoles, and data center cooling solutions.
  • Automotive & EV Electronics – Battery thermal management, inverters, and power control modules.
  • 5G & Telecommunications – Effective cooling for high-speed networking devices and base stations.
  • Industrial & Medical Equipment – Heat dissipation for power electronics, sensors, and imaging systems.
Typical Properties
Properties Unit TG-P10050 TG-10090 Tolerance Test Method
Thermal Conductivity (XY axis) W/m•K 1500~1800 1500~1800 – AC Calorimeter
Thermal Conductivity (Z axis) W/m•K 12 12 – Laser Flash
Total Thickness μm 50 90 – Meter
Copper Foil Thickness μm 35 75 – Meter
Coating Thickness μm 15 15 – Meter
Vertical Resistivity (XY axis) Ohm-inch² 2.57 2.57 – QJ1523-1988
Parallel Resistivity (Z axis) Ohm-inch² 0.66 0.66 – QJ1523-1988
Cross-cut Tape Test – 4B 4B – ASTM D3359B
Pencil Hardness Test – 2H 2H – ASTM D3363
Solvent Resistance (Alcohol) – Pass(5 times) Pass(5 times) – ASTM D5402
Rubber Abrasive Test – Pass(150 times) Pass(150 times) – ASTM D7835
High Temperature & Humidity Test @85° C/85%RH – Pass(500 hrs) Pass(500 hrs) – IEC-60068-2-78
Thermal Shock Test @-20~+80° C – Pass(500 cycles) Pass(500 cycles) – IEC-60068-2-14
Temperature Range °C -20~+120 -20~+120 – ISO 16750-4

T-Global TG-P100 Series Datasheet





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