Description
TG-AD66 by T-Global Technology is a next-generation ultra soft thermal gap filler pad that blends exceptional thermal performance (6.5W/m-K) with a gentle shore OO hardness of 25, making it perfect for high performance electronics where both heat dissipation and low mechanical stress are critical.
Designed for thermally demanding applications that involve fragile components, low-profile packages, or mechanically sensitive environments, TG-AD66 fills microscopic gaps with ease, ensuring low thermal resistance wile protecting delicate assemblies from damage due to compression or vibration.
Its silicone based, highly conformable structure allows it to flow into surface irregularities and provide consistent, durable thermal contact, ideal for applications such as EV batteries, 5G modules, compact power electronics, and advanced medical or aerospace electronics.
Benefits
- High Thermal Conductivity (6.5 W/m·K): Enables rapid heat dissipation in dense or high-wattage devices.
- Ultra-Soft Material (Shore OO 25): Prevents damage to fragile solder joints, BGAs, or low-force PCBs.
- Precision Conformability: Perfect for uneven or irregular surfaces in compact assemblies.
