Description
TG-AD30 from T-Global Technology is a premium ultra-soft thermal gap filler pad engineered to deliver reliable heat transfer while minimising mechanical stress on sensitive components. With a thermal conductivity of 3.0 W/m-K and an exceptionally low Shore OO hardness of 20, TG-AD30 is ideal for applications requiring gentle compression, such as fragile or low-profile electronic components.
Its soft silicone formulation ensures excellent surface conformity, allowing TG-AD30 to fill even the smallest gaps and surface irregularities. The material delivers stable thermal performance across wide operating temperatures while providing electrical insulation, mechanical dampening, and long-term durability.
TG-AD30 is the go to solution for designers needing a balance of thermal conductivity and mechanical compliance especially in thin or vibration sensitive assemblies like wearables, mobile devices, sensors, and medical electronics.
Benefits
- Low-Stress Thermal Management: Ultra-soft material (Shore OO 20) protects delicate components and solder joints.
- Good Thermal Performance: 3.0 W/m·K conductivity supports moderate heat dissipation in compact devices.
- Reliable Electrical Insulation: Prevents shorts and supports high-voltage isolation.
