Description
The T-Global TG-A9000 Ultra Soft Thermal Pad is a high-performance silicone thermal interface material (TIM) designed to deliver reliable heat dissipation in advanced electronics. With a thermal conductivity of 9.0 W/m·K, this ultra-soft gap filler offers low thermal impedance and excellent compression to ensure effective thermal coupling even across uneven surfaces.
Engineered for demanding industries such as EV power modules, 5G infrastructure, AI accelerators, and telecom systems, the TG-A9000 provides robust electrical insulation, high dielectric strength (≥ 8 kV/mm), and a broad operating temperature range from –50 °C to +180 °C.
Available in thicknesses from 0.5 mm up to 8.0 mm and in die-cut formats or full sheets, it is well suited for custom integration in modern high-density designs.
The TG-A9000 is ideal for thermal management in high-power applications where reliable, stable heat transfer is crucial, and where surface irregularities or micro-gaps must be bridged with a compliant interface.
Benefits
- By lowering thermal impedance and improving contact, TG-A9000 helps maintain lower hotspot temperatures, reducing thermal stress on components.
- Available in various thicknesses and die-cut shapes, it can be tailored to a wide range of board layouts and component geometries.
- Thanks to its strong dielectric properties, it can be implemented near high-voltage or signal-sensitive circuits without risk of electrical leakage or interference.
