Description
TG-A6200F from T-Global Technology is a high performance thermal gap filler pad that delivers reliable thermal conductivity of 5.0W/m-K and is reinforced with a fiberglass mesh layer on one side for enhanced mechanical strength, easy handling, and shape retention. This hybrid design offers a balance of thermal efficiency, structural integrity, and production friendly characteristics, making it a go to material for demanding applications in power electronics, EVs, and telecom systems.
The fiberglass backing significantly improves the pads tear resistance and dimensional stability during placement or rework, which is especially useful in automated assembly lines or tight mechanical enclosures. Its silicone based formulation ensures excellent gap filling performance, low thermal resistance, and full electrical insulation, supporting long term operation under thermal cycling and mechanical stress.
Benefits
- Balanced Thermal and Mechanical Performance: 5.0 W/m·K conductivity combined with reinforced handling support.
- Fiberglass Mesh for Stability: Enhances ease of alignment, installation repeatability, and material longevity.
- Suitable for High-Throughput Environments: Ideal for consistent performance in both manual and automated assembly.





