Description
TG-A3500F from T-Global Technology is a durable, mid performance thermal gap filler pad featuring a thermal conductivity of 3.0 W/m-K and an integrated fiberglass mesh on one side. Designed for easier handling, tear resistance, and dimensional stability, this pad is ideal for high volume manufacturing environments and assemblies that require enhanced material strength without sacrificing thermal performance.
The embedded fiberglass layer enhances the pad’s structural integrity, making it easier to position during assembly and especially useful for automated or manual installations. At the same time, its silicone based composition provides excellent surface conformity, low thermal resistance, and electrical insulation, making it a strong fir for power modules, motor drives, and industrial controls.
TG-A3500F strikes a balance between mechanical durability and thermal efficiency, it is a smart choice for thermal engineers seeking robustness, repeatability, and efficiency in production.
Benefits
- Enhanced Handling & Strength: Fiberglass mesh backing improves stability during application and rework.
- Reliable Thermal Conductivity (3.0 W/m·K): Ideal for moderate-power heat dissipation needs.
- Dimensional Stability: Resists stretching, tearing, or warping during assembly or use.
