Description
T-Global TG-A3500 is a high-performance thermal gap filler pad designed to provide efficient heat transfer between electronic components and heatsinks or enclosures. With a thermal conductivity of 3.5W/m-K, TG-A3500 ensures reliable thermal management across a wide range of applications, from power electronics to consumer devices.
This soft, compliant, and silicone-based gap filler is ideal for filling uneven surfaces and maintaining thermal contact without excessive pressure. TG-A3500 combines excellent thermal conductivity, mechanical compliance, and long-term reliability, making it a preferred solution for engineers seeking to improve heat dissipation in compact or irregular assemblies.
Optimised for performance, compliance, and ease of use, TG-A3500 thermal interface pads are used globally n industries such as automotive, telecommunications, and industrial electronics.
Benefits
- Superior Thermal Conductivity (3.5 W/m·K): Enhances heat dissipation from heat-sensitive components.
- Excellent Conformability: Fills gaps and irregular surfaces without damaging delicate components.
- Easy to Handle and Apply
