Description
TG-A1780 from T-Global Technology is an ultra-thermal performance gap filler pad designed to manage extreme heat loads in advanced electronic systems. With an outstanding thermal conductivity of 17.8W/m-K, TG-A1780 represents one of the most thermally conductive silicone-based thermal interface materials (TIMs) on the market.
Created for next-gen power electronics, EVs, data infrastructure, and RF applications, TG-A1780 combines thermal excellence with mechanical compliance. Its soft, elastic structure conforms to uneven surfaces and fills micro-gaps, significantly reducing thermal resistance without damaging delicate components.
Whether you’re designing for edge computing, AI accelerators, or high-voltage power modules, TG-A1780 delivers maximum thermal performance, even under extreme operating conditions.
Benefits
- Unmatched Thermal Conductivity (17.8 W/m·K): Ideal for the most demanding heat dissipation requirements.
- Stress-Free Conformability: Fills gaps while minimizing mechanical load on components and PCBs.
- Safe and Electrically Insulating: Offers strong dielectric protection with thermal functionality.
