Description
TG-A1250 from T-Global Technologies is an ultra-high performance thermal gap filler pad, purpose-built for the most thermally demanding electronics and power systems. With a remarkable thermal conductivity of 12.5W/m-K, TG-A1250 is designed to deliver maximum heat transfer efficiency, making it ideal for high-power, high-density applications where conventional gap fillers cannot meet thermal requirements.
This soft, conformable silicone-based material bridges large and uneven gaps while ensuring low thermal resistance and reliable electrical insulation. Its excellent mechanical compliance makes it particularly well-suited for sensitive components and assemblies subject to thermal cycling, vibration, or structural movement.
When you need a high-end thermal interface material (TIM) capable of withstanding extreme workloads, TG-A1250 is a top-tier solution trusted across EVs, power electronics, data centers, and 5G infrastructure.
Benefits
- Class-Leading Thermal Conductivity (12.5 W/m·K): Enables rapid and efficient heat dissipation for high-power electronics.
- Soft and Conformable: Reduces stress on components while ensuring consistent thermal contact.
- Reliable Electrical Insulation: Maintains safety and performance in high-voltage environments.
