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Tflex™ SF600 is a high performance, silicone-free thermal gap filler with a conductivity of 3 W/mK. Tflex SF600 is designed for applications which are silicone sensitive. Tflex SF600 is naturally tacky on both sides, requiring no adhesive coating and allowing for the pad to be held in place during assembly. For applications that may require rework, a differential tack option is available to remove the natural tack from one side of the material.
TYPICAL PROPERTIES | TYPICAL VALUE | TEST METHOD |
---|---|---|
Construction & Composition | Boron nitride filled sheet | N/A |
Colour | Rose | Visual |
Thickness Range | 0.25mm (0.010”) – 3.56mm (0.140”) | N/A |
Thermal Conductivity (W/mK) | 3.0 | ASTM D5470 |
Density (g/cc) | 1.27 | Helium Pyncometer |
Hardness (Shore 00) | 80 | ASTM D2240 |
Outgassing TML (weight %) | 1.30 | ASTM E595 |
Outgassing CVCM (weight %) | 0.63 | ASTM E595 |
Temperature Range | -20°C to 125°C | N/A |
Rth@ 40 mils, 10 psi, 500C | 0.81°C–in2/W | ASTM D5470 (modified) |
Dielectric Constant @ 10GHz | 3.5 * | ASTM D150 |
UL Flammability Rating | V-0 | UL 94 |
Volume Resistivity | 10^14 ohm-cm | ASTM D257 |
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