Tflex™ SF10 – 3.25mm | Laird | Silicone Free Thermal Gap FillerCustom pads and gaskets priced instantly and made to order within 24 hours!

Tflex™ SF10 – 3.25mm | Laird | Silicone Free Thermal Gap Filler

Silicone Free Thermal Gap Filler | A18213-13

To get an instant quote for your custom parts, please select your currency and follow steps 1 to 4.

$
£
€
  • Silicone free formulation
  • Thermal conductivity = 10.0 W/ mK
  • Low pressure versus deflection
View Product Details | Need Help With Ordering? | How To Order Video
Download Datasheet
Checking availability...

Stock sheet size: 22.86cm x 22.86cm

Tell us what to manufacture and give us your delivery date

You are asking us to manufacture a custom shape. Enter your values below

Uploading a .pdf is required for a custom shape, we also use .pdf to verify dimensions and tolerences of your custom parts

Uploading a .dxf is the preferred file to manufacture your parts

Download here

Download the drawing guide to help you with your pad and gasket design

Enter your delivery address

Item(s) shipping address*

Please ensure your shipping address is entered correctly here. Your order may be cancelled if an incorrect country has been entered. See our terms and conditions for more information.

Order Total Discount
£1 - £500 N/A
£501 - £1000 1% discount
£1001 - £2500 2% discount
£2501 - £5000 3% discount
£5001 - £10000 4% discount
£10001 - £25000 5% discount
£25001 - £50000 7.5% discount
£50001+ 10% discount
SKU: 94087 Categories: , , , Brand:

Description

Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.

This material is supplied in thicknesses of 0.5mm – 5mm.

A18213-13

 

Other Thicknesses:

Benefits

  • No fiberglass reinforcement
  • Minimizes board and component stress
  • Low Shore Hardness
  • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH

Features

  • Silicone free formulation
  • Thermal conductivity = 10.0 W/mK
  • Low pressure versus deflection

Recommended Uses

  • Automotive Electronics, Automotive ADAS, Automotive Powertrain/ECUs, Automotive Infotainment, Routers, Hard Disk Drives, Solid State Drives, Wireless infrastructure, Drones/Satellites, Gaming Systems, Smart Home Devices, Notebooks/Tablets/Portable Devices

Typical Properties

Properties Typical Value Test Method
Construction & Composition Ceramic filled silicone thermoplastic N/A
Color Grey Visual
Thickness Range 0.5mm – 5mm (+/- 10%) N/A
Thermal Conductivity 10 W/mk Hot Disk
Density 3.7 g/cc Helium Pycnometer
Thermal Resistance (1.5mm) @
30% deflection, 50 0C		 1.312 °C–cm2/W (0.203 Cin2/W) ASTM D5470
Temperature Range -40°C to 125°C Laird Test Method
Hardness Shore 00 (3 second) 41 (1mm-4mm) ASTM D2240
70 (0.5mm – 0.75mm) ASTM D2240
Hardness Shore 00 (30 second) 8 (1mm – 4mm) ASTM D2240
50 (0.5mm – 0.75mm) ASTM D2240
Outgassing (TML%) 0.33 ASTM E595
Outgassing (CVCM %) 0.15 ASTM E595
Dielectric Constant @1MHz 9 ASTM D150
Volume Resistivity (Ω cm) 10^14 ASTM D257
UL Flammability Rating V-0 (1mm-5mm) UL 94
V-0 (0.5mm-0.75mm, pending) UL 94

Laird Tflex SF10





    Materials Direct

    Precision cut technical materials fast. We’re available to assist you for your next project

    A division of Universal Science UK
    www.universal-science.com

    Related products