Description
Tflex HD80000 combines 6.0 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
The Tflex HD80000 material is extremely soft, but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product.
A17882-04
Benefits
- Low pressure versus deflection
- Minimizes board and component stress
- Low outgassing and oil bleeding
