Tflex™ HD7.5 – 4.5mm | Laird | Silicone Based Thermal Gap FillerCustom pads and gaskets priced instantly and made to order within 24 hours!

Tflex™ HD7.5 – 4.5mm | Laird | Silicone Based Thermal Gap Filler

Silicone based Thermal Gap Filler | A18443-18

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  •  Extremely soft and compliant silicone gap filler
  •  Thermal conductivity = 7.5 W/mK
  •  Provides good electrical isolation
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Stock sheet size: 22.86cm x 22.86cm

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Description

Laird’s Tflex™ HD7.5 gap filler is a new developed very soft  silicone material in our high deflection series.  With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics.  The material will provide minimal stress on components during application while maintaining low thermal resistance.  As a result, less mechanical and thermal stresses will be experienced within your device.

A18443-18

Benefits

  • Low pressure versus deflection
  • Minimizes board and component stress
  • Low outgassing and oil bleeding

Features

  • Extremely soft and compliant silicone gap filler
  • Thermal conductivity = 7.5 W/mK
  • Exerts very low pressures to devices and components when in operation

Specifications

Typical Properties Value Test Method
Construction & Composition Ceramic filled silicone sheet N/A
Color Grey Visual
Thickness Range 1mm (0.040”) – 5mm (0.200”) N/A
Thermal Conductivity (W/mK) 7.5 Hot Disk
6.8 ASTMD5470
Density (g/cc) 3.4 Helium Pycnometer
Hardness Shore 00 (3 sec) 15 ASTM D2240
Hardness Shore 000 (3 sec) 60 ASTM D2240
Outgassing TML (weight %) 0.20 ASTM E595
Outgassing CVCM (weight %) 0.02 ASTM E595
Temperature Range -40°C to 125°C Laird Test Method
Rth at 1mm, 10 psi 0.119°C–in2/W ASTM D5470
Dielectric Constant at 1 MHz 7.94 ASTM D150
UL Flammability Rating V-0 UL 94
Volume Resistivity 1.1X10¹⁴Ω.cm ASTM D257

Laird Tflex HD7.5 Datasheet





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