TflexTM 600 is an exceptionally soft, highly compliant gap-filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness, produces incredibly low thermal resistances. Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is electrically insulating, stable from –45°C to 200°C and meets UL 94 V0 rating.
Very high compliancy for low stress applications
3 W/mK thermal conductivity
Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm)
Naturally tacky, needs no further adhesive coating
Low Thermal Resistance
Gap fillers are also well suited for high volume production of electronic components such as batteries, inverters/converters, motors and power electronics.