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18 Sheets In Stock
EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER
TflexTM 600 is an exceptionally soft, highly compliant gap-filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness, produces incredibly low thermal resistances. Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is electrically insulating, stable from –45°C to 200°C and meets UL 94 V0 rating.
TYPICAL PROPERTIES | VALUE | TEST METHOD |
---|---|---|
Construction & Composition | Ceramic filled silicone sheet | N/A |
Colour | Blue-Viloet | Visua |
Thickness Range | 0.50mm (0.020”) - 5.08mm (0.20”) | N/A |
Thermal Conductivity (W/mK) | 3.0 | ASTM D5470 |
Density (g/cc) | 1.34 | Helium Pyncometer |
Hardness (Shore 00) | 51 | ASTM D2240 |
Outgassing TML (weight %) | 0.13 | ASTM E595 |
Outgassing CVCM (weight %) | 0.05 | ASTM E595 |
Temperature Range | -45°C to 200°C | N/A |
Rth@ 40 mils, 10 psi, 500C | 0.62°C–in2/W | ASTM D5470 (modified) |
Dielectric Constant @ 10GHz | 4.0 | ASTM D150 |
UL Flammability Rating | V-0 | UL 94 |
Volume Resistivity (ohm-cm) | 2 x 10^13 | ASTM D257 |
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