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Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times.
Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
|Typicial Properties||Value||Test Method|
|Construction & Composition||Ceramic filled silicone sheet||N/A|
|Thickness Range||0.50mm (0.020”) - 5.08mm (0.20”)||N/A|
|Thermal Conductivity (W/mK)||1.2||ASTM D5470|
|Density (g/cc)||1.78||Helium Pyncometer|
|Hardness (Shore 00)||51.4 (20-30 mil) 25.2 (40+ mil)||ASTM D2240|
|Outgassing TML (weight %)||0.56||ASTM E595|
|Outgassing CVCM (weight %)||0.1||ASTM E595|
|Temperature Range||-40°C to 160°C||N/A|
|Rth@ 40 mils, 10 psi, 500C||0.98°C–in2/W||ASTM D5470 (modified)|
|* Dielectric Constant @ 10GHz||4.5 *||ASTM D150|
|UL Flammability Rating||V-0||UL 94|
|Volume Resistivity||10^13 ohm-cm||ASTM D257|
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