Description
The high rate of compliancy of Tflex™ 300TG allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures.
A Tgard™ silicone liner has been added to the Tflex™ 300TG to offer a guaranteed dielectric barrier. The Tgard™ is cut-through resistant and provides easier part handling in mass production.
A18053-20
Benefits
- Low compression set enables the pad to be reused many times
- The Tgard™ is cut-through resistant and provides easier part handling in mass production
