T-flex™ 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers.
T-flex™ 200 V0 combines good thermal conductivity of 1.1 W/mK with high conformability to produce low thermal resistance. The alumina filler allows T-flex™ 200 V0 to remain a cost-effective solution where moderate thermal performance is acceptable.
T-flex™ 200 V0 is naturally tacky and does not need an additional adhesive coating that can inhibit thermal performance.
T-flex™ 200 V0 is electrically insulating, stable from -40°C to 160°C and meets UL 94 VO rating.
Soft and compressible for low stress applications
Naturally tacky needing no further adhesive coating
1.1 W/mK thermal conductivity
Available in thicknesses from 0.010" (0.25mm) to 0.200" (5.0mm)
Cooling components to the chassis or frame. High speed mass storage drives. RDRAM memory modules. Heat pipe thermal solutions. Automotive engine control units. Wireless communication hardware.