LOCTITE THERMSTRATE 2000 phase-change thermal interface material is suitable for use between a heat sink and a variety of heat-dissipating components. This product is supplied as a dry compound coated onto an aluminum substrate. The compound is designed to flow at the phase change temperature, conforming to the surface features of the heat sink and component. Upon flow, and in conjunction with component mounting pressure, air is expelled from the interface, reducing thermal impedance, performing as a highly efficient thermal transfer material. THERMSTRATE 2000 is a superior replacement for messy thermal greases and similar interface compounds.
THERMSTRATE 2000 is a superior replacement for messy thermal greases and similar interface compounds.
THERMSTRATE 2000 is supplied in a range of substrate thicknesses
Phase-change thermal interface material
Supplied as a dry compound coated onto an aluminum substrate.
A highly efficient thermal transfer material
THERMSTRATE 2000 phase-change thermal interface material is suitable for use between a heat sink and a variety of heat dissipating components
Typical Assembly Applications
DC-DC converters, Solid state relays,
Power transistors, Power modules, IGBT,
RF components or Used between any
non-isolated heat dissipating component
and a heat sink or chassis
THERMSTRATE 2000 is supplied in a range of substrate thicknesses to match surface finish and flatness considerations in the interface area. For more details, please see the data sheet in the Downloads.
Phase Change Temperature, °C
Volumetric expansion of thermal compound
upon phase change, %
Viscosity above phase change temperature
Pre-tooled pads are available for many commonly used electronic devices.
THERMSTRATE 2000 may be available as single die-cut pads, multi-pad sheets, or on continuous rolls for high volume production.
THERMSTRATE 2000 is also available with adhesive edge strips for ease of assembly. In this case, the pad will be oversized so that the adhesive is outside the thermal path. This enables the adhesive to be provided without compromising the thermal performance of the portion of the pad in the contact area of the thermal path.