Description
Universal Science™ T-Pad® 6500 is a non-silicone electrically isolating thermal interface material that delivers an exceptionally high level of thermal conductivity working out at 6.5W/Mk, it also maintains its temperature stability across a wider range of temperatures in addition to having a dielectric constant of 3.1 @1MHz.
T-Pad® 6500 is highly suited for rugged and extremely demanding applications as well as silicone sensitive applications. Its inherent softness removes micro air voids between contact surfaces at the interface. The cold-flow action of T-Pad® mounted to a cold wall or chassis, via a spring, metal clip or clip, delivers reliable and high thermal performance whilst also guaranteeing electrical isolation, some use cases for this material are mounting heat generating electronic devices or PCB’s to a cold wall, chassis or heatsink, thermally coupling T0220 and T0247 devices to heatsinks or nearby metal work.
A2 – Adhesive layer on both sides.
Other Thicknesses:
Adhesive Options:
- T-Pad 6500™ – A1 – 0.2mm
- T-Pad 6500™ – A2 – 0.2mm ← You are here
Benefits
- Guaranteed electrical isolation
- Fills micro air voids between device and mating metal work at the interface, improving thermal performance
- Maintains temperature stability over a wide range of temperatures
