Description
Universal Science™ T-Pad® 6500 is a non-silicone electrically isolating thermal interface material that delivers an exceptionally high level of thermal conductivity working out at 6.5W/Mk, it also maintains its temperature stability across a wider range of temperatures in addition to having a dielectric constant of 3.1 @1MHz.
T-Pad® is highly suited for rugged and extremely demanding applications as well as silicone sensitive applications. Its inherent softness removes micro air voids between contact surfaces at the interface. The cold-flow action of T-Pad® mounted to a cold wall or chassis, via a spring, metal clip or clip, delivers reliable and high thermal performance whilst also guaranteeing electrical isolation, some use cases for this material are mounting heat generating electronic devices or PCB’s to a cold wall, chassis or heatsink, thermally coupling T0220 and T0247 devices to heatsinks or nearby metal work.
A0 = No Adhesive
Other Thicknesses:
- T-Pad 6500™ – A0 – 0.1mm ← You are here
- T-Pad 6500™ – A0 – 0.2mm
Adhesive Options:
Benefits
- Guaranteed electrical isolation
- Fills micro air voids between device and mating metal work at the interface, improving thermal performance
- Maintains temperature stability over a wide range of temperatures
