Description
T-Pad 3000 is a highly durable pad, formulated to thermally connect hot electronic devices to a cold wall or nearby metal work whilst also maintaining electrical insulation. The cold flow action of T-Pad 3000 and its soft surfaces on both sides, deliver a good thermal wet out between mating surfaces, this obviates micro air voids for reduced thermal resistance and improved thermal performance. T-Pad 3000 can be supplied in die-cut shapes for use in a wide range of electronic applications.
A0 = No Adhesive on either side
Other Thicknesses:
- T-Pad 3000™ – A0 – 0.23mm
- T-Pad 3000™ – A0 – 0.5mm ← You are here
Adhesive Options:
Benefits
- Guaranteed electrical isolation
- Fills micro air voids between device and mating metal work at the interface. Improving thermal performance
- Maintains temperature stability over a wide range of temperatures





