Softtherm 86/235 – 2mm | Kerafol™

Silicone Thermally Conductive Pad

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  • Very soft and vibration dampening
  • Thermal conductivity of 2.0W/mK
  •  Elastic behavior
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Stock sheet size: 25cm x 45cm

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Description

The Kerafol Softtherm 86/235 is a high-performance thermal interface material that stands out for its exceptional softness and elasticity, making it highly effective in filling gaps and enhancing thermal conductivity between components. Its single-layer composition is specifically designed to provide efficient heat transfer while compensating for mechanical impacts such as vibrations. Furthermore, the Softtherm 86/235 is engineered to be low bleeding, with volatile silicone levels below 150ppm, ensuring long-term stability and performance in sensitive electronic applications. With its excellent thermal, mechanical, and dielectric properties, the Softtherm 86/235 is an ideal solution for a wide range of thermal management requirements.

Benefits

  • low TML
  • Also available as a double layer material
  • Elastic behavior

Features

  • Low thermal resistance
  • Thermal conductivity of 2.0W/mK
  • Elastic behavior

Recommended Uses

  • Mounting heat generating electronic devices or PCB’s to a cold wall, chassis or heatsink
  • Cooling power devices mounted to a heatsink or chassis in PSUs

Typical Properties

Properties Unit 86/235
Colour Yellow
Assembly single layer, fibreglass reinforcement up to 2.0mm

Thermal Properties

Properties Unit 86/235
Thermal Resistance Rᵀᴴ K/W 1.2
Thermal Conductivity λ W/mK 2.0

Electrical Properties

Properties Unit 86/235
Dielectric Breakdown Voltage U kV 6.0
Volume Resistivity Ωm 1.7 x 10¹¹
Dielectric Loss Factor tan δ 2.0 x 10¯²
Dielectric Constant 3.7

Mechanical Properties

Properties Unit 86/235
Hardness Shore 00 25 – 45
Young’s Modulus N/cm² 32

Physical Properties

Properties Unit 86/235
Application Temperature °C -40 to +200
Density g/cm³ 1.65
Total Mass loss (TML) Ma.-% < 0.10
Flame Rating UL-94 V-0
Possible Thickness mm 0.5 – 5.0





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