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Bergquist Gap Pad TGP 1000VOUS – 1mm
August 5, 2019
Bergquist Sil Pad TSP 1800ST – 0.203mm
August 5, 2019
Bergquist Sil Pad TSP 2000 – 0.38mm
Known as BERGQUIST GAP PAD 2000S40
£0.00
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- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Highly Conformable, low hardness
2 Sheets In Stock
Description
BERGQUIST GAP PAD TGP 2000 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
BERGQUIST GAP PAD TGP 2000 is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling.
Benefits
- Designed for low-stress applications
- Fiberglass reinforced for puncture, shear and tear resistance
Features
- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Highly Conformable, low hardness
Recommended Uses
- Power electronics DC/DC; 1/4, 1/2, full bricks, etc.
- Mass storage devices
- Graphics card / processor / ASIC
- Wireline / wireless communications hardware
- Automotive engine / transmission controls
Physical Properties
| Hardness, Shore 00 , Thirty second delay value , ASTM D2240, Bulk rubber | 30 |
| Heat Capacity, ASTM E1269, J/g-K | 0.6 |
| Density, Bulk rubber, ASTM D792, g/cc | 2.9 |
| Flammability, UL 94 | V-0 |
| Young's Modulus, ASTM D575 | kPa 310 (psi) (45) |
Electrical Properties
| Dielectric Breakdown Voltage , ASTM D149, VAC | >5,000 |
| Dielectric Constant, ASTM D150, 1,000Hz | 6.0 |
| Volume Resistivity, ASTM D257, ohm-meter | 1×10¹º |
Thermal Properties
| Thermal Conductivity, ASTM D5470, W/(m-K) Thermal Impedance, 0.040 inch ASTM D5470, ºC-in2 /W: | 2.0 |
| 10% Deflection | 0.97 |
| 20% Deflection | 0.89 |
| 30% Deflection | 0.8 |
| Thermal Impedance, ASTM D5470, ºC-in2 /W | |
|---|---|
| @ 10 psi | 0.95 |
| @ 25 psi | 0.75 |
| @ 50 psi | 0.61 |
| @ 100 psi | 0.47 |
| @ 200 psi | 0.41 |
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
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- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
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