Therm-a-Gap G579 – 1.5mm | Parker ChomericsCustom pads and gaskets priced instantly and made to order within 24 hours!

Therm-a-Gap G579 – 1.5mm | Parker Chomerics

Reinforced Silicone Gap Filler

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  • Soft and compliant gap filler
  • Thermal conductivity = 3.0 W/ mK
  • Vibration dampening
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Stock sheet size: 22.8cm x 22.8cm

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SKU: 94163 Categories: , , Brand:

Description

Parker Chomerics THERM-A-GAP™ G579 is a thermally conductive gap filler pad designed to provide efficient heat transfer in electronic devices. With a thermal conductivity of 3.0 W/m-K, it ensures effective heat dissipation. Its low hardness, with a Shore 00 rating of 30, offers excellent conformability to uneven surfaces. The material composition includes a woven glass carrier, providing durability without the need for pressure-sensitive adhesive (PSA). It operates within a temperature range of -67°F to +392°F (-55°C to +200°C), making it suitable for a wide range of applications. Additionally, it meets UL 94 V-0 flammability standards and RoHS compliance. This gap filler pad is ideal for applications requiring high thermal performance and flexibility, such as in automotive electronics, telecommunications, and consumer electronics.

Benefits

  • Ultra low deflection force
  • High tack surface reduces contact resistance

Features

  • Vibration dampening
  • Thermal conductivity = 3.0 W/mK
  • Soft and compliant gap filler

Recommended Uses

  • Telecommunications equipment
  • Consumer electronics
  • Automotive electronics (ECUs)
  • LEDs, lighting
  • Power conversion
  • Power semiconductors
  • Desktop computers, laptops, servers
  • Handheld devices
  • Memory modules
Typical Physical Properties
Property (unit) Test Method Therm-a-Gap G579
Colour Visual Pink
Binder – Silicone
Specific Gravity ASTM D792 2.9
Propertey Test Method Therm-a-Gap G579
Percent Deflection @ Various Pressures (0.125 in thick sample) % Deflected ASTM C165
MOD (0.125 in
“G” Type, 0.50
in dia probe,
0.025 in/min rate)
@5 psi (34kPa) 22 ASTM C165
@10 psi (69 kPa) 33 ASTM C165
@25 psi (172 kPa) 55 ASTM C165
@50 psi (345 kPa) 68 ASTM C165

Thermal Properties

Property (unit) Test Method Therm-a-Gap G579
Thermal Conductivity, W/m-K ASTM D5470 3
Thermal Impedance, °C-in2
/W (°C-cm2
/W)
@ 10 psi, @ 0.04 in (1 mm) thick, “G” version only		 ASTM D5470 0.7
(4.5)
Heat Capacity, J/g-K ASTM E1269 1
Coefficient of Thermal Expansion, ppm/K Chomerics 150

Electrical Properties

Properties Test Method Therm-a-Gap G579
Dielectric Strength, Vac/mil (kVac/mm) Chomerics 200 (8)
Volume Resistivity, ohm-cm ASTM D149 10¹⁴
Dielectric Constant @ 1,000 kHz ASTM D257 8.0
Dissipation Factor @ 1,000 kHz ASTM D150 0.010

Regulatory Properties

Property Test Method Therm-a-Gap G579
Flammability Rating UL 94 V-0
RoHS Compliant Yes Chomerics
Certification
Outgassing, % TML (% CVCM) ASTM E595 0.19 (0.06)
Storage Conditions, °F (°C) @ 50%
Relative Humidity		 Chomerics 50 to 90
(10 to 32)

Therm-a-Gap Datasheet





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