Tpcm 7000 Series – 7250 – 0.25mm | Laird

Non-Silicone Phase Change TIM | A18171-10

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  • 7.5 W/mK bulk thermal conductivity
  • Fully characterized long term reliability
  • Non silicone formulation that provides naturally tacky surface
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Stock sheet size: 45.72cm x 45.72cm

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Order Total Discount
£1 - £500 N/A
£501 - £1000 1% discount
£1001 - £2500 2% discount
£2501 - £5000 3% discount
£5001 - £10000 4% discount
£10001 - £25000 5% discount
£25001 - £50000 7.5% discount
£50001+ 10% discount

Description

Tpcm 7000 is newest in Laird’s line of  high-performance TIM product offerings. With a thermal conductivity of 7.5 W/mK, Tpcm 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics.  Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm.Coupled with superior wetting of the mating  surfaces and displacing air, Tpcm™ 7000 provides industry leading lowest thermal resistance.  Tpcm™ 7000 reliability has been demonstrated though exposure to 2000 hours of various aging tests resulting in proven dependability at an operating temperature of 150°C.  The specialty polymeric matrix offers superior pump out resistance when compared to thermally conductive  greases and other phase change materials.  Tpcm™ 7000 has been formulated to provide just the right tack, remaining on liners yet easily removeable for application.

A18171-10

 

Other Thicknesses:

Benefits

  • 7.5 W/mK bulk thermal conductivity
  • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
  • No pump out

Features

  • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
  • Non silicone formulation that provides naturally tacky surface
  • Easy rework

Recommended Uses

  • Graphics Card
  • Desktops
  • Servers
  • IGBTs
  • Automotive
  • Memory Modules
  • Game Consoles

Typical Properties

Properties Value Test Method
Construction Free Standing, Filled, NonSilicone Thermoplastic N/A
Color Gray Visual
Thickness 0.13mm, 0.20mm,
0.25mm, 0.40mm
–
Density 2.5 g/cc Helium Pycnometer
Bulk Thermal Conductivity 7.5 W/m-K Hot Disk
Thermal Resistance
10 psi & 70°C 0.10°C-cm²
/W
ASTM D5470
50 psi & 70°C 0.06°C-cm²
/W
ASTM D5470
Operating Temperature Range -40°C to 125°C Laird Test Method
Softening Temperature Range 50°C to 70°C Laird Test Method
Minimum Bondline Thickness 35µm Laird Test Method
Dielectric Constant 31.54 @1MHz ASTM D150
Volume Resistivity 5.4×10¹⁵ Ω-cm ASTM D991
UL Recognition V0 UL94





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