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Laird Tflex™ HD700 thermal gap pad combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
A17653-05
Specifications
| Typical Properties | Value | Test Method |
|---|---|---|
| Construction & Composition | Ceramic filled silicone sheet | N/A |
| Color | Pink (*Option for Dark Grey) | Visual |
| Thickness Range | 0.50mm (0.020”) 5.0mm (0.20”) | N/A |
| Thickness Tolerance | +/- 10% | N/A |
| Thermal Conductivity (W/mK) | 5.0 | ASTM D5470 |
| Density (g/cc) | 3.3 | Helium Pycnometer |
| Hardness (Shore 00) | 54 | ASTM D2240 |
| Outgassing TML (weight %) | 0.23 | ASTM E595 |
| Outgassing CVCM (weight %) | 0.07 | ASTM E595 |
| Temperature Range | -50°C to 200°C | Laird Test Method |
| Rth@ 40 mils, 10 psi | 0.287°C–in2/W | ASTM D5470 (Modified) |
| Dielectric Constant @ 1 MHz | 5.01 | ASTM D150 |
| UL Flammability Rating | V-0 | UL 94 |
| Volume Resistivity | 1.4x 10×14 ohm-cm | ASTM D257 |
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