Description
Laird Tflex™ HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
DC1 = DC1 = Only one side of the Material has its tacky properties
A17690-04
Benefits
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- Minimizes board and component stress





