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3 Sheets In Stock
Laird TflexTM HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Laird’s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed with customer applications in mind.
Tflex HD300 material exhibits excellent surface wetting characteristics and high deflection properties ensuring low contact resistances and providing an overall lower total thermal resistance.
A Tgard™ liner at one side option is provided to form into Tflex HD300TG, offer guaranteed >6KV AC dielectric barrier, is cut-through resistant and enables easy non-tacky handling at one side.
A Tgard™ liner in the middle option is provided to form into Tflex HD300MTG for 40mil and above thicknesses, offer guaranteed >6KV AC dielectric barrier, has cut-through resistant and two-sided tackiness.
|Typical Properties||Value||Test Method|
|Construction & Composition||Ceramic filled silicone sheet||N/A|
|Thickness Range||0.50mm (0.020”) 5.0mm (0.20”)||N/A|
|Thickness Range||+/- 10%||N/A|
|Thermal Conductivity (W/mK)||2.7||ASTM D5470|
|Density (g/cc)||3.1||Helium Pycnometer|
|Hardness (Shore 00)||38||ASTM D2240|
|Outgassing TML (weight %)||0.39||ASTM E595|
|Outgassing CVCM (weight %)||0.10||ASTM E595|
|Temperature Range||-40°C to 200°C*||Laird Test Method|
|Rth@ 40 mils, 10 psi||0.573°C–in2/W||ASTM D5470 (Modified)|
|Dielectric Constant @ 1 MHz||6.62||ASTM D150|
|UL Flammability Rating||V-0||UL-94|
|Volume Resistivity||1.2x 1014||ASTM D257|
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A division of Universal Science UK
Ceramic filled gap filling pad
Thermal conductivity = 6.0W/mK
Compliant surfaces on both sides function to reduce interfacial thermal resistance