Tflex™ HD300 Series – 3.56mm | Laird

Silicone Thermal Gap Filler | A17156-14

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  • 2.7 W/m K thermal conductivity
  • Low pressure versus deflection characteristics
  • Excellent surface wetting for low contact resistance
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Stock sheet size: 22.8cm x 22.8cm

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Description

Laird TflexTM HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Laird’s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed with customer applications in mind.

Tflex HD300 material exhibits excellent surface wetting characteristics and high deflection properties ensuring low contact resistances and providing an overall lower total thermal resistance.

A Tgard™ liner at one side option is provided to form into Tflex HD300TG, offer guaranteed >6KV AC dielectric barrier, is cut-through resistant and enables easy non-tacky handling at one side.

A Tgard™ liner in the middle option is provided to form into Tflex HD300MTG for 40mil and above thicknesses, offer guaranteed >6KV AC dielectric barrier, has cut-through resistant and two-sided tackiness.

Manufacturers SKU: A17156-14

Benefits

  • Excellent surface wetting for low contact resistance
  • Design flexibility due to favorable deflection characteristics
  • Available in sheet or die cut form

Features

  • 2.7 W/mK thermal conductivity
  • Thickness: .5mm to 5mm (.020” to .200”)
  • Naturally tacky or available with Laird’s tack eliminating DC1 coating (DC1 available on one side only).
  • Low Pressure versus deflection
  • RoHS and REACH compliant

Recommended Uses

  • Market general applications where low interface pressures are critical
  • Large tolerance applications
Specifications
Typical Properties Value Test Method
Construction & Composition Ceramic filled silicone sheet N/A
Colour Pink Visual
Thickness Range 0.50mm (0.020”) 5.0mm (0.20”) N/A
Thickness Range +/- 10% N/A
Thermal Conductivity (W/mK) 2.7 ASTM D5470
Density (g/cc) 3.1 Helium Pycnometer
Hardness (Shore 00) 38 ASTM D2240
Outgassing TML (weight %) 0.39 ASTM E595
Outgassing CVCM (weight %) 0.10 ASTM E595
Temperature Range -40°C to 200°C* Laird Test Method
Rth@ 40 mils, 10 psi 0.573°C–in2/W ASTM D5470 (Modified)
Dielectric Constant @ 1 MHz 6.62 ASTM D150
UL Flammability Rating V-0 UL-94
Volume Resistivity 1.2x 1014 ASTM D257





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