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Laird Tflex™ HD300 Series – 3.56mm
Thermal Gap Filler
£0.00
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- 2.7 W/m K thermal conductivity
- Low pressure versus deflection characteristics
- Excellent surface wetting for low contact resistance
3 Sheets In Stock
Description
Laird TflexTM HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Laird’s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed with customer applications in mind.
Tflex HD300 material exhibits excellent surface wetting characteristics and high deflection properties ensuring low contact resistances and providing an overall lower total thermal resistance.
A Tgard™ liner at one side option is provided to form into Tflex HD300TG, offer guaranteed >6KV AC dielectric barrier, is cut-through resistant and enables easy non-tacky handling at one side.
A Tgard™ liner in the middle option is provided to form into Tflex HD300MTG for 40mil and above thicknesses, offer guaranteed >6KV AC dielectric barrier, has cut-through resistant and two-sided tackiness.
Benefits
- Excellent surface wetting for low contact resistance
- Design flexibility due to favorable deflection characteristics
- Available in sheet or die cut form
Features
- 2.7 W/mK thermal conductivity
- Thickness: .5mm to 5mm (.020” to .200”)
- Naturally tacky or available with Laird’s tack eliminating DC1 coating (DC1 available on one side only).
- Low Pressure versus deflection
- RoHS and REACH compliant
Recommended Uses
- Market general applications where low interface pressures are critical
- Large tolerance applications
Specifications
| Typical Properties | Value | Test Method |
|---|---|---|
| Construction & Composition | Ceramic filled silicone sheet | N/A |
| Colour | Pink | Visual |
| Thickness Range | 0.50mm (0.020”) 5.0mm (0.20”) | N/A |
| Thickness Range | +/- 10% | N/A |
| Thermal Conductivity (W/mK) | 2.7 | ASTM D5470 |
| Density (g/cc) | 3.1 | Helium Pycnometer |
| Hardness (Shore 00) | 38 | ASTM D2240 |
| Outgassing TML (weight %) | 0.39 | ASTM E595 |
| Outgassing CVCM (weight %) | 0.10 | ASTM E595 |
| Temperature Range | -40°C to 200°C* | Laird Test Method |
| Rth@ 40 mils, 10 psi | 0.573°C–in2/W | ASTM D5470 (Modified) |
| Dielectric Constant @ 1 MHz | 6.62 | ASTM D150 |
| UL Flammability Rating | V-0 | UL-94 |
| Volume Resistivity | 1.2x 1014 | ASTM D257 |
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Universal Science UniGap 6000 – 5mm
£0.00 SKU: 93509Ceramic filled gap filling pad
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