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Laird Tflex™ 300 Series – 3200 – 5mm
February 13, 2022Laird Tflex™ 300 Series – 380 – 2mm
August 5, 2019
Laird T-flex™ 300 Series – 3160 – 4.06mm
Thermal Gap Filler
£0.00
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- Extreme compliancy allows material to “totally blanket” components
- Thermal conductivity of 1.2 W/mK
- Low compression set enables the pad to be reused many times
Product is on backorder
Description
Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times.
Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
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- Compliant and electrically isolating
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- Maintains good thermal performance over a temperature range of -50°C to 160°C
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Select options
Compliant and electrically isolating
Thermal conductivity = 1.0 W/mK
Maintains good thermal performance over a temperature range of -50C to 160C
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