Gap Pad TGP HC3000 – 0.25mm | BergquistCustom pads and gaskets priced instantly and made to order within 24 hours!

Gap Pad TGP HC3000 – 0.25mm | Bergquist

Known as Gap Pad HC3000 | Silicone

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  • Thermal Conductivity: 3.0 W/m-K
  • High-compliance, low compression stress
  • Fiberglass reinforced for shear and tear resistance
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Description

The BERGQUIST® GAP PAD® TGP HC3000 is a high-performance, silicone-based thermal interface material (TIM) engineered to provide efficient heat transfer and electrical insulation in advanced electronic assemblies. Designed by Henkel, this soft and highly conformable thermal pad ensures optimal contact between heat-generating components and heat sinks, minimizing thermal resistance and maximizing heat dissipation.

With a thermal conductivity of 3.0 W/m·K, the TGP HC3000 is ideal for applications requiring low-stress thermal management, such as power electronics, automotive modules, high-performance computing, and telecommunications hardware. Reinforced with fiberglass, it offers excellent puncture, tear, and shear resistance, ensuring durability while maintaining flexibility to fill air gaps.

Benefits

  • High Thermal Conductivity (3.0 W/m·K)
  • Excellent Conformability
  • Durable and Electrically Insulating

Features

High Thermal Conductivity (3.0 W/m·K)

  • Effectively dissipates heat, preventing component failure and extending device lifespan.

Ultra-Soft & Highly Conformable

  • Fills microscopic air gaps, ensuring low thermal resistance and superior heat transfer.

Low “S-Class” Thermal Resistance

  • Optimized for applications requiring low-pressure contact to reduce stress on fragile components.

Fiberglass Reinforcement for Durability

  • Provides puncture, tear, and shear resistance, ensuring long-term reliability.

Natural Inherent Tack on Both Sides

  • Eliminates the need for thermally-impeding adhesive layers, simplifying assembly processes.

Electrical Insulation

  • Prevents short circuits, enhancing the safety and reliability of electronic assemblies.

UL 94 V-0 Flammability Rating

  • Meets stringent fire safety standards for automotive, industrial, and aerospace applications.

Wide Operating Temperature Range (-60°C to 200°C)

  • Functions reliably in harsh environments and extreme conditions.

Recommended Uses

  • Power Electronics & Energy Systems: Used in DC/DC converters, inverters, and battery management systems (BMS) for efficient heat management.
  • Computing & High-Performance GPUs/CPUs: Provides effective thermal interface solutions for CPUs, GPUs, SSDs, and gaming hardware.
  • Telecommunications & 5G Networks: Enhances heat dissipation in RF modules, routers, base stations, and fiber optic equipment.
  • Automotive & Electric Vehicles (EVs): Ensures thermal reliability in ECUs, ADAS systems, and power control modules.
  • Industrial Equipment & IoT Devices: Prevents overheating in factory automation controllers, robotics, and IoT hardware.
  • LED & Lighting Solutions: Helps improve thermal efficiency and lifespan of high-powered LEDs and smart lighting systems.
Specifications
Technology Silicone
Appearance Blue
Reinforcement Carrier Fiberglass
Thickness
ASTM D374		 0.508 to 3.175 mm
Inherent Surface Tack 2
Application Thermal management,
TIM (Thermal Interface Material)
Operating Temperature
Range		 -60 to 200ºC
Physical Properties
Properties Value
Hardness, Shore 00, Thirty second delay value,
ASTM D2240, Bulk rubber		 15
Heat Capacity, ASTM E1269, J/g-K 1.0
Density, Bulk rubber, ASTM D792, g/cc 3.1
Flammability, UL 94 V-0
Young’s Modulus, ASTM D575 kPa 110, (psi 16)
Electrical Properties
Properties Value
Dielectric Breakdown Voltage , ASTM D149,
Minimum value @ 20 mil, VAC		 5,000
Dielectric Constant, ASTM D150, 1,000Hz 6.5
Volume Resistivity, ASTM D257, ohm-meter 1×10¹º
Thermal Properties
Thermal Impedance, 0.040″(2)
ASTM D5470, ºC-in2
/W:		 Vlue
10% Deflection 0.57
20% Deflection 0.49
30% Deflection 0.44

Bergquist Gap Pad TGP HC3000 Datasheet





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