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Bergquist Gap Pad TGP HC3000 – 1mm
Known as Gap Pad HC 3.0
£0.00
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
14 Sheets In Stock
Description
BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.
Benefits
- Natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers.
- HC3000 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography
Features
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
Recommended Uses
- Telecommunications
- ASICs and DSPs
- Consumer electronics
- Thermal modules to heat sinks
Specifications
| Technology | Silicone |
| Appearance | Blue |
| Reinforcement Carrier | Fiberglass |
| Thickness ASTM D374 | 0.508 to 3.175 mm |
| Inherent Surface Tack | 2 |
| Application | Thermal management, TIM (Thermal Interface Material) |
| Operating Temperature Range | -60 to 200ºC |
Physical Properties
| Properties | Value |
|---|---|
| Hardness, Shore 00, Thirty second delay value, ASTM D2240, Bulk rubber | 15 |
| Heat Capacity, ASTM E1269, J/g-K | 1.0 |
| Density, Bulk rubber, ASTM D792, g/cc | 3.1 |
| Flammability, UL 94 | V-0 |
| Young's Modulus, ASTM D575 | kPa 110, (psi 16) |
Electrical Properties
| Properties | Value |
|---|---|
| Dielectric Breakdown Voltage , ASTM D149, Minimum value @ 20 mil, VAC | 5,000 |
| Dielectric Constant, ASTM D150, 1,000Hz | 6.5 |
| Volume Resistivity, ASTM D257, ohm-meter | 1×10¹º |
Thermal Properties
| Thermal Impedance, 0.040"(2) ASTM D5470, ºC-in2 /W: | Vlue |
|---|---|
| 10% Deflection | 0.57 |
| 20% Deflection | 0.49 |
| 30% Deflection | 0.44 |
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