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14 Sheets In Stock
BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.
|Thickness ASTM D374||0.508 to 3.175 mm|
|Inherent Surface Tack||2|
|Application||Thermal management, TIM (Thermal Interface Material)|
|Operating Temperature Range||-60 to 200ºC|
|Hardness, Shore 00, Thirty second delay value, ASTM D2240, Bulk rubber||15|
|Heat Capacity, ASTM E1269, J/g-K||1.0|
|Density, Bulk rubber, ASTM D792, g/cc||3.1|
|Flammability, UL 94||V-0|
|Young's Modulus, ASTM D575||kPa 110, (psi 16)|
|Dielectric Breakdown Voltage , ASTM D149, Minimum value @ 20 mil, VAC||5,000|
|Dielectric Constant, ASTM D150, 1,000Hz||6.5|
|Volume Resistivity, ASTM D257, ohm-meter||1×10¹º|
|Thermal Impedance, 0.040"(2) ASTM D5470, ºC-in2 /W:||Vlue|
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A division of Universal Science UK
Ceramic filled gap filling pad
Thermal conductivity = 6.0W/mK
Compliant surfaces on both sides function to reduce interfacial thermal resistance