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BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC3000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC3000 is supplied with protective liners on both sides.
Technology | Silicone |
Appearance | Blue |
Reinforcement Carrier | Fiberglass |
Thickness ASTM D374 | 0.508 to 3.175 mm |
Inherent Surface Tack | 2 |
Application | Thermal management, TIM (Thermal Interface Material) |
Operating Temperature Range | -60 to 200ºC |
Properties | Value |
---|---|
Hardness, Shore 00, Thirty second delay value, ASTM D2240, Bulk rubber | 15 |
Heat Capacity, ASTM E1269, J/g-K | 1.0 |
Density, Bulk rubber, ASTM D792, g/cc | 3.1 |
Flammability, UL 94 | V-0 |
Young's Modulus, ASTM D575 | kPa 110 (psi 16) |
Properties | Value |
---|---|
Dielectric Breakdown Voltage , ASTM D149, Minimum value @ 20 mil, VAC | 5,000 |
Dielectric Constant, ASTM D150, 1,000Hz | 6.5 |
Volume Resistivity, ASTM D257, ohm-meter | 1×10¹º |
Properties | Value |
---|---|
Thermal Conductivity, ASTM D5470, W/(m-K) | 3.0 |
Thermal Impedance, 0.040"(2) ASTM D5470, ºC-in2 /W: 10% Deflection | 0.57 |
Thermal Impedance, 0.040"(2) ASTM D5470, ºC-in2 /W: 20% Deflection | 0.49 |
Thermal Impedance, 0.040"(2) ASTM D5470, ºC-in2 /W: 30% Deflection | 0.44 |
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Compliant and electrically isolating
Thermal conductivity = 1.0 W/mK
Maintains good thermal performance over a temperature range of -50C to 160C
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