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BondShield Cu Si is a soft copper foil with a double-sided electrically conductive pressure-sensitive adhesive. It is suitable for RF/ EMI shielding on motors, cables, and components.
|Bondshield CU Si
|Adhesive Strength N/cm
|Tensile Strength (N/cm)
|Soft Copper Foil
|Base Thickness (mm)
|Total Thickness (mm)
|Available in standard thicknesses of 0.085
|Supplied on 33M rolls and to specified widths on request.
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