BondShield Cu Si™ – 0.085mm | Universal Science™Custom pads and gaskets priced instantly and made to order within 24 hours!

BondShield Cu Si™ – 0.085mm | Universal Science™

Double Sided Copper Adhesive Tape

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  • RFI/ EMI shielding copper tape
  • Conformability fills micro air voids between mating surfaces.
  • Bonding of conductive surfaces.
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Stock sheet size: 300cm x 3300cm

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£501 - £1000 1% discount
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SKU: 93629 Categories: , Tags: , , , , , , , , Brand:

Description

BondShield Cu Si is a soft copper foil with a double-sided electrically conductive pressure-sensitive adhesive. It is suitable for RF/ EMI shielding on motors, cables, and components.

Benefits

  • Provides excellent adhesion between a variety of substrates
  • Delivers a permanent mechanical bond with high dielectric strength
  • Simple to handle and apply

Features

  • RFI/ EMI shielding aluminium tape
  • Conformability fills micro air voids between mating surfaces.
  • Bonding of conductive surfaces.
  • Electrically grounding

Recommended Uses

  • For applications that require; RFI and eEMI shielding, Moisture resistance, Electrically conductive. Solderable as a heating element.
Typical Physical Properties
Property (unit) Test
Method		 Bondshield CU
Si
Colour Visua Copper
Adhesive Coating Double
Sided
Interliner Siliconized
Paper
Temperature
resistance(°C)		 In House 155
Electrical and Mechanical Information
Property (unit) Test Method BondShiled
Cu
Adhesive Strength
N/cm		 ASTM D-1002 4.5
Tensile Strength (N/cm) ASTM 412 40.0
Supporting Base Soft Copper
Foil
Base Thickness (mm) 0.035
Total Thickness (mm) 0.085
Availability
Available in standard thicknesses of 0.085
Supplied on 33M rolls and to specified widths on
request.

Universal Science BondSheild Cu Si Datasheet





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