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BondShield Cu is a soft copper foil with a thermosetting polyacrylate resin adhesive, this is available with or without a paper liner. It is suitable for RF/ EMI shielding on motors, cables and components.
Property (unit) | Test Method | Bondshield CU |
---|---|---|
Colour | Visua | Copper |
Adhesive Coating | Single Sided | |
Recommended Curing cycle | 1 hour at 150 ° 2hours at 130 ° | |
Temperature Resistamce(°C) | In House | 155 |
Property (unit) | Test Method | BondShiled Cu |
---|---|---|
Adhesive Strength N/cm | ASTM D-1002 | 4.5 |
Tensile Strength (N/cm) | ASTM 412 | 40.0 |
Supporting Base | Soft Copper Foil | |
Base Thickness (mm) | 0.040 | |
Total Thickness (mm) | 0.065 |
Available in standard thicknesses of 0.065 |
Supplied on 33M rolls and to specified widths on request. |
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