BondShield Cu™ – 0.065mm | Universal Science™Custom pads and gaskets priced instantly and made to order within 24 hours!

BondShield Cu™ – 0.065mm | Universal Science™

Copper Adhesive Tape

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  • RFI/ EMI shielding copper tape
  • Conformability fills micro air voids between mating surfaces.
  • Solderable as a heating element.
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Stock sheet size: 300cm x 3300cm

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SKU: 93628 Categories: , Tags: , , , , , , , Brand:

Description

BondShield Cu is a soft copper foil with a thermosetting polyacrylate resin adhesive, this is available with or without a paper liner. It is suitable for RF/ EMI shielding on motors, cables and components.

Benefits

  • Provides excellent adhesion between a variety of substrates
  • Delivers a permanent mechanical bond with high dielectric strength
  • Simple to handle and apply

Features

  • RFI/ EMI shielding aluminium tape
  • Conformability fills micro air voids between mating surfaces.
  • Solderable as a heating element.
  • Moisture resistant
  • Electrically conductive

Recommended Uses

  • For applications that require; RFI and eEMI shielding, Moisture resistance, Electrically conductive. Solderable as a heating element.
Typical Physical Properties
Property (unit) Test
Method		 Bondshield CU
Colour Visua Copper
Adhesive Coating Single
Sided
Recommended
Curing cycle		 1 hour at
150 °
2hours at
130 °
Temperature
Resistamce(°C)		 In House 155
Electrical and Mechanical Information
Property (unit) Test Method BondShiled
Cu
Adhesive Strength
N/cm		 ASTM D-1002 4.5
Tensile Strength (N/cm) ASTM 412 40.0
Supporting Base Soft Copper
Foil
Base Thickness (mm) 0.040
Total Thickness (mm) 0.065
Availability
Available in standard thicknesses of 0.065
Supplied on 33M rolls and to specified widths on
request.

Universal Science BondSheild Cu Datasheet





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