BondShield Cu is a soft copper foil with a thermosetting polyacrylate resin adhesive, this is available with or without a paper liner. It is suitable for RF/ EMI shielding on motors, cables and components.
Provides excellent adhesion between a variety of substrates
Delivers a permanent mechanical bond with high dielectric strength
Simple to handle and apply
RFI/ EMI shielding aluminium tape
Conformability fills micro air voids between mating surfaces.
Solderable as a heating element.
For applications that require; RFI and eEMI shielding, Moisture resistance, Electrically conductive. Solderable as a heating element.
Typical Physical Properties
1 hour at
Electrical and Mechanical Information
Tensile Strength (N/cm)
Base Thickness (mm)
Total Thickness (mm)
Available in standard thicknesses of 0.065
Supplied on 33M rolls and to specified widths on