LOADING
Universal Science BondShield Cu Si – 0.085mm
August 5, 2019
Laird Tflex 600 Series – Tflex 6200 – 5mm
August 5, 2019
Universal Science BondShield Cu – 0.065mm
Copper Adhesive Tape
£0.00
To get an instant quote for your custom parts, please select your currency and follow steps 1 to 4.
$
£
€
- RFI/ EMI shielding aluminium tape
- Conformability fills micro air voids between mating surfaces.
- Solderable as a heating element.
Product is on backorder, Please allow 35 working days for delivery of this item
Description
BondShield Cu is a soft copper foil with a thermosetting polyacrylate resin adhesive, this is available with or without a paper liner. It is suitable for RF/ EMI shielding on motors, cables and components.
Benefits
- Provides excellent adhesion between a variety of substrates
- Delivers a permanent mechanical bond with high dielectric strength
- Simple to handle and apply
Features
- RFI/ EMI shielding aluminium tape
- Conformability fills micro air voids between mating surfaces.
- Solderable as a heating element.
- Moisture resistant
- Electrically conductive
Recommended Uses
- For applications that require; RFI and eEMI shielding, Moisture resistance, Electrically conductive. Solderable as a heating element.
Typical Physical Properties
| Property (unit) | Test Method | Bondshield CU |
|---|---|---|
| Colour | Visua | Copper |
| Adhesive Coating | Single Sided | |
| Recommended Curing cycle | 1 hour at 150 ° 2hours at 130 ° | |
| Temperature Resistamce(°C) | In House | 155 |
Electrical and Mechanical Information
| Property (unit) | Test Method | BondShiled Cu |
|---|---|---|
| Adhesive Strength N/cm | ASTM D-1002 | 4.5 |
| Tensile Strength (N/cm) | ASTM 412 | 40.0 |
| Supporting Base | Soft Copper Foil | |
| Base Thickness (mm) | 0.040 | |
| Total Thickness (mm) | 0.065 |
Availability
| Available in standard thicknesses of 0.065 |
| Supplied on 33M rolls and to specified widths on request. |
Materials Direct
Precision cut technical materials fast
We’re available to assist you for your next project
A division of Universal Science UK
www.universal-science.com
Related products
-
Add to basket
- RFI/ EMI shielding aluminium tape
- Conformability fills micro air voids between mating surfaces.
- Solderable as a heating element.
-
Select options
- RFI/ EMI shielding aluminium tape
- Conformability fills micro air voids between mating surfaces.
- Bonding of conductive surfaces.
-
Select options
- EMI/ RFI Shielding aluminium tape
- Completely Moisture Resistant
- Reflects heat
Reviews
There are no reviews yet.