Description
Bondline 700 is an electrically isolating thermal adhesive tape designed to mechanically fix and thermally connect electronic devices and FR4 PCBs to a heatsink. Formulated from acrylic, Bondline 700 is pressure sensitive and the differing thicknesses conform to varying surface textures which fills micro-air voids between contact surfaces and reduces thermal resistance. Bondline 700 is developed for applications requiring good thermal transfer, dielectric strength and permanent adhesion.
Benefits
- Provides excellent adhesion between a variety of substrates
- Delivers a permanent mechanical bond with high dielectric strength
- Simple to handle and apply
